EDI Press Release

MARK D. MILLER BECOMES EDI PROJECT AND MANUFACTURING ENGINEER, WITH WIDE-RANGING RESPONSIBILITIES FOR TECHNOLOGY DEVELOPMENT

CHIPPEWA FALLS, WI, U.S.A., July 12, 2006: Extrusion Dies Industries, LLC (EDI), an international supplier of flat-die systems for extrusion and web converting, has appointed Mark D. Miller to be project and manufacturing engineer.

In this position Miller will work closely with John A. Ulcej, executive vice president of engineering and technology, on developing new die manufacturing processes, designing innovative die systems, and providing technical support to customers.

“Mark’s professional background in polymer science and process development has given him an expert understanding of extrusion and coating die systems,” said Ulcej. “He is well prepared to help our customers identify the optimal die system for a specific application and assist them in bringing that system to peak performance levels.”

Mark Miller comes to EDI after nine years at 3M Company, where his responsibilities included R&D on applications involving slot and extrusion coating dies, development of polymeric adhesive formulations for coating systems, and production of optical films for a wide range of electronic devices.

Miller holds a Masters degree in polymer science and engineering from Lehigh University and a Bachelors degree in chemical engineering from the University of Wisconsin.